Infineon and Valeo are collaborating on a short-distance ground projection module integrating laser beam scanning (LBS). Their first collaborative innovation was showcased at the 2026 Beijing auto show.
Daytime visibility for ground projections requires high-performance systems. By incorporating Infineon’s 2D microelectronic mechanical systems (MEMS) mirror and its controller into Valeo’s high-definition ground projection module, the new solution provides superior brightness, contrast, and resolution. While the first generation delivers bi-colour output, the product roadmap is already planned for future iterations to include full-colour capability.
Infineon XVP of Sensors and RF Thomas Schafbauer says “Sensors are at the heart of every meaningful electronic application. With more than 30 years of expertise and our broad Xensiv™ portfolio, we are uniquely positioned to enable the next generation of automotive experiences. Our collaboration with Valeo demonstrates how we go beyond a single device to deliver comprehensive, automotive-qualified solutions. By combining Infineon’s 2D MEMS technology with Valeo’s advanced ground projection module, we are proud to be shaping the future of mobility together”.
Maurizio Martinelli, CEO of Valeo’s Light Division, says “Thanks to our joint development, our new ground projection module meets the demands of customers in China and in Europe for a more personalized experience, as well as the automotive industry’s stringent standards for quality, reliability, and performance. This initiative reflects our commitment to accelerating the adoption of advanced technologies and delivering innovative, integrated solutions that drive the future of mobility”.
