Revolutionary single-chip architecture will soon be on the market. Radars are moving to higher frequencies – 120 GHz, 300 Ghz – with a single-chip arrangement including the antenna on package and computing power supporting AI algorithms.
We’re also seeing the first lidar-on-chip products, using FMCW signal processing and solid-state silicon photonics technology. The resultant smaller sensors, with a high-resolution capability, will support easier car integration and lower costs. We bring you news, information, and analysis in this edition of your DVN Sensing newsletter to understand what’s up and coming.
And take a look at our interview with Mercedes-Benz’s former Head of Radar who’s now joining DVN as a senior advisor, our special report on Autosens, and technology news from across the industry.
Mark your calendars for upcoming DVN events:
- 8th Sensing & Applications Conference at Wiesbaden, Germany on 19 – 20 November – the finalized docket is in today’s newsletter
- AEB Workshop in Detroit next 25 – 26 March.
We’re ever so glad you’re here with us in the DVN Sensing community. Enjoy this 44th newsletter!
All best,
